Vertical integration
Active region epitaxy process
Grating technology
Secondary and above epitaxial process
Wafer process
Automated chip testing
High-frequency chip testing
Reliability testing and verification
Active region epitaxy process
We purchase substrate and gas source only to carry out independent development and production of epitaxy;
InGaAsP and AllnGaAs dual-material epitaxy technology;
Buried waveguide epitaxy technology
Grating technology
Holographic grating lithography;
EB phase grating technology;
100nm linewidth etching technology.
Secondary and above epitaxial process
Years of epitaxy experience ensure the yield of multi-epitaxy products;
Heterojunction epitaxy technology;
Optical device integration technology;
Production of high-efficiency electrical injection material;
Production of functional optical waveguide material.
Wafer process
Years of accumulation in wafer process details;
Process parametric statistics control
Automated chip testing
Introduce automated chip testing machine from abroad to fully control the whole testing process;
Select the products (- 40 ~ 95 ° C) at room temperature, high temperature and low temperature to control product quality by tests;
Ability to test and analyze important parameters such as luminous power, temperature sensitivity, spectrum, backlight and divergence angles;
The fiber transmission sensitivity test system is employed to predict the test result at the client side in advance.
High-frequency chip testing
Independent CoC packaging design verifies high-frequency chip design;
Full-temperature eye diagram and bandwidth test system strictly control the products for shipment;
RIN test system stabilizes products from noise interference.
Reliability testing and verification
Reliability testing and verification
The reliability of every chip is tested to accurately ensure the quality of each wafer;
Airtight and non-airtight aging test, high-temperature aging test, dual 85 test, low-temperature storage, temperature cycling test, ESD, push and pull test.
